About D
What is D-process?
【At D-process, we carry out a wide range of CMP contract processing from prototype to volume production. D-process also performs wafer bonding contract processing. We perform pretreatment for wafer bonding by CMP contract processing and offer consistent services leading up to the wafer bonding contract processing.】
Applications
Applications
- 1：TSV
- 2：CMOS
- 3：Various MEMS
- 4：Power devices (Si, SiC, GaN, SJ, etc.)
- 5：DRAM
- 6：SAW devices (TC SAW, etc.)
- 7：Heat sinks
- 8：Optical devices
- 9：Communication devices
- 10：Various platforms
Materials
- Metal materials: Au, Ag, Rh, Ru, Cu, Co, CoPd, Al, W,
Ta, TaN, Ti, TiN, Ni, Ni-P, Ni-Fe,
Pd, Cr, ZnO, etc. - Insulation materials: SiO₂, TEOS, various polymers, etc.
- Substrate materials: Si, SiC, GaN, Al₂O₃, Al₂O₃ composite material, LT,
LN, polymer, etc.
Total process foundry
| Wafer/Chip size | |
|---|---|
| CMP | Chip to 12 inch |
| Wafer Bonding | Chip to 12 inch |
| Back Grinding (thinning process) | Chip to 12 inch |
| Ultra-precision cleaning | Up to 12 inch |
| Spin coating | Up to 8 inch |
| Wafer lapping /diamond polishing | Up to 12 inch |
| Dicing | Up to 12 inch |
| Photolithography | 4 to 8 inch |
| Wafer Edge processing | Up to 12 inch |
| Wet etching | 4, 6, 8, 12 inch |
| Seed layer formation | Chip to 12 inch |
| Plating (Electroplating, electroless plating) | Chip to 12 inch |
