D-process Market
Market
D-scanner
D-scanner is a metrology instrument of surface roughness measurement with unique features such as higher throughput same as laser microscope, and higher resolution same as AFM.
□Enables to measure 100μm X 100µm area in just 30 seconds!
We offer flexible proposals in order to fit your metrology needs. For example, you use D-scanner especially for highly frequent inspection processes to enhance your production volume, and you only use AFM for final sampling inspection which reduces your total process time significantly.
Desktop CMP equipment
We offer a desktop CMP equipment that is suitable from prototypes to small volume production, and the CMP process established by D-process can be transferred/reproduced on customer site
Various wafers
D-process Market offers various high-quality wafers with many achievements in CMP Foundry.
| No. | Film type | Film thickness[nm] | Film thickness allowance | Standard delivery time |
|---|---|---|---|---|
| 1 | Thermal oxide film | 100 | ±10% | 2.5 weeks |
| 2 | LP-SiN | 250 | ±10% | 4 weeks |
| 3 | P-SiN | 500 | ±10% | 4 weeks |
| 4 | Resist (i-line positive) | 3000 | ±10% | 3 weeks |
| 5 | P-TEOS | 600 | ±10% | 1.5 months |
| 6 | Thermal oxide film + Al-Cu | Thermal oxide film 500 / Al-Cu 1000 | ±10% | 1.5 months |
| 7 | Thermal oxide film +Al-Si-Cu | Thermal oxide film 500 / Al-Si-Cu 1000 | ±10% | 1.5 months |
| 8 | Pure-Al | 100 | ±10% | 1 month |
| 9 | Thermal oxide film +Ti+Cu | Thermal oxide film 100 / Ti 50 / Cu 1000 | ±10% | 1.5 months |
| 10 | Thermal oxide film +Poly-Si | Thermal oxide film 100 / Poly-Si 200 | ±10% | 2 months |
| 11 | Thermal oxide film +Ti+W | Thermal oxide film 100 / Ti 25 / W 65 | ±10% | Please inquire |
| 12 | Cu re-plating | Up to 20000 | ±10% | 2 weeks |
