OTHER
Other
Total Foundry System
Other processes and contract processing
Typical examples of processes
| Back grinding | Dicing | Ultra-precision cleaning |
| Lapping/ brdiamond polishing |
Photolithography | Spin coating |
| Wafer Edge processing | Wet etching | Circle cutting & irregular shape cutting |
Back grinding
Lapping/diamond polishing
Electroplating
Electroless plating
Seed layer formation (sputtering/deposition/electroless plating)
Materials for which electroless plating is supported: Cu, Au, Ni
Materials for which deposition is supported: Cu, Au, Ni, Ti, Al, Cr
Materials for which sputtering is supported: Cu, Au, Ni, Al, Cr, etc. and all other materials...
Dicing
Ultra-precision cleaning
Photolithography
| Bump x height | Bump diameter | ||||||
|---|---|---|---|---|---|---|---|
| 〜10μm | 〜30μm | 〜50μm | 〜70μm | 〜90μm | 90μm〜 | ||
| Bump height |
〜10μm | △ | △ | ◯ | ◯ | ◯ | ◯ |
| 〜30μm | × | △ | △ | ◯ | ◯ | ◯ | |
| 〜50μm | × | × | △ | △ | ◯ | ◯ | |
| 〜70μm | × | × | × | × | △ | △ | |
Please inquire for details, as complexity varies depending on specifications (bump pitch, wafer size, etc.).
Remarks
・Please inquire for availability of desired specifications other than those above.
・Photolithography processing is supported for one side only (both sides can be processed if certain conditions are met)
・Masks can be created (support available from CAD drawing creation)
・We can propose our standard alignment marks
Wafer Edge processing
Wet etching
